|ELECTRON MICROSCOPY UNIT
FEI FIB200TEM focused ion beam microscope and machining
Jeol 6500 FEG Scanning Electron Microscope
Bruker-AXS D8 4-circle thin film X-ray diffractometer
D3000 Multi-mode SPM
Tecnai F20 – This field emission high-resolution transmission
electron microscope is an exceptional tool; it has a 200kV
accelerating voltage giving it sufficient resolution for atomic
level imaging of microstructures defects and interfaces in
materials. It belongs to the first series of TEM to feature
complete digital control of the embedded analytical peripherals.
This allows easy switching between parallel and axial beams, TEM
and STEM, diffraction and mass loss contrast or the range of
ancillary techniques including energy filtered mapping and EDS
FIB200TEM – This instrument is similar to a SEM, but rather
than electrons, it uses a beam of Ga ions to assist in imaging.
However, most significantly it is possible to use the Ga beam to
perform micro-machining of thin films; thus patterns and
structures can be cut into materials with feature sizes as small
as 10nm. In addition Pt and SiO can be deposited for wiring and testing
of the nano-features. Our system also includes a SIMS for
depth-profiling and elemental mapping during machining.
Bruker-AXS D8 X-ray Diffractometer – All the materials that
we prepare have some form of periodic structure, whether it is
epitaxial single crystal thin films and superlattices or
amorphous metals in complex multilayered structures. X-ray
diffraction is used to investigate these periodicities to
determine crystal structure etc.
The JEOL 6500 FEGSEM in addition to
imaging at resolutions close to 1.5nm this new instrument is
equipped with EDX and WDS chemical analysis systems.
The DI D3000 technical information to be