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Foundry

Queen's Advanced Micro-Engineering Centre houses a suite of semiconductor processing equipment which are available for customer foundry needs. The equipment set encompasses all sides of silicon processing including:

  •  Photomask design and printing.
  •  Photolithography
  •  Chemical vapour deposition
  •  Diffusion processes(doping and oxidation)
  •  Etch(wet chemical etch, RIE,  deep ICP etching)
  •  Metalisation
  •  Test
  • Chemical Mechanical Polishing

Follow the Foundry Link for more details of what is on offer.

A copy of the QAMEC Brochure can be found by following the link: publisher   pdf

For further information contact the QAMEC manager

 

 Equipment Available

Wafer Size 

 

75mm 

100mm 

150mm 

200mm

LPCVD LT Oxide/Nitride/Poly silicon 

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PECVD Oxide/Nitride Deposition 

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CVD Tungsten/Silicide

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PVD Metal Deposition 

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Thermal Processing:  Wet and Dry Oxidation.

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Rapid Thermal Annealing

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Chemical Mechanical Polishing  Si, Ge, Cu

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ALD Al2O3, HfO2

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Lithography 2µm feature size

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Photoresist Coat and Develop Tracks 

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EV Double Sided Aligner

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e-Beam Lithography 

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RIE IE of Si3N4,SiO2 and silicon

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Wafer Bonding

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ICP Deep Etch

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Oxide Etch 

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Poly Etch 

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Metal Etch 

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Wet Processing

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Surface Treatment 

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Anodic Bonding 

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Evaporation

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Surface and Thin Film Measurement

     

 

Measurement and Test

 

 

 

 

SEM

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Mask Making. Design and manufacture

125 -150mm SQ reticle