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ModuleInformation

ELE8055

Microelectronic Technology

Course Contents

The technology used in the fabrication of silicon devices and integrated circuits. Thermal oxidation of silicon; Solid State Diffusion of dopants; Ion-Implantation technology: Basic system design and gas kinetics for the growth of Epitaxial Silicon; Plasma physics as applied to reactive ion etching and sputtering. The MOS capacitor as an analytical tool.

Supplementary Notes

None

Learning Outcomes

  • To examine in detail the theoretical and practical aspects of semiconductor device fabrication process.
  • To provide an understanding of the key technologies used in the manufacture of integrated circuits and silicon discrete devices.
  • To provide sufficient knowledge of the basic mechanisms to enable the students to optimise the processes for silicon device applications.
  • To introduce the students to in-situ monitoring and post layer deposition evaluation.
  • To examine the fundamentals of layer depositions and etching so that the student can adapt these techniques to other functional materials.

Skills

Assimilation of lecture material.