Foundry

Queen's Advanced Micro-Engineering Centre houses a suite of semiconductor processing equipment which are available for customer foundry needs. The equipment set encompasses all sides of silicon processing including:
- Photomask design and printing.
- Photolithography
- Chemical vapour deposition
- Diffusion processes(doping and oxidation)
- Etch(wet chemical etch, RIE, deep ICP etching)
- Metalisation
- Test
- Chemical Mechanical Polishing
Follow the Foundry Link for more details of what is on offer.
A copy of the QAMEC Brochure can be found by following the link: publisher pdf
For further information contact the QAMEC manager.
Process Available |
Wafer Size |
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75mm |
100mm |
150mm |
200mm |
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LPCVD Poly silicon |
× |
× |
× |
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PECVD Oxide/Nitride Deposition |
× |
× |
× |
× |
CVD Tungsten/Silicide |
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× |
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PVD Metal Deposition |
× |
× |
× |
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Thermal Processing: Wet and Dry Oxidation. |
× |
× |
× |
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3D nanoscale printing: Nanoscribe Photonic Professional GT |
3D Polymer Printing from nm to micron scale
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Chemical Mechanical Polishing (contact for information) |
× |
× |
× |
× |
ALD Al2O3, HfO2 |
× |
× |
× |
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Optical Lithography >4µm feature size |
× |
× |
× |
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Photoresist Coat and Develop |
× |
× |
× |
× |
EV Double Sided Aligner |
× |
× |
× |
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RIE IE of Si3N4,SiO2 |
× |
× |
× |
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ICP Deep Etch |
× |
× |
× |
× |
Oxide wet Etch |
× |
× |
× |
X |
Poly Wet Etch |
× |
× |
× |
× |
Metal Wet Etch |
× |
× |
× |
× |
Wet Processing |
× |
× |
× |
× |
Surface Treatment |
× |
× |
× |
× |
Evaporation |
× |
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Surface and Thin Film Measurement |
x | x | x | x |
Measurement and Test |
x |
Test include CV, IV, Transistor characteristics etc | ||
SEM |
× |
× |
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Mask Making. Design and manufacture |
125 -150mm SQ reticle |
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