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Foundry

Queen's Advanced Micro-Engineering Centre houses a suite of semiconductor processing equipment which are available for customer foundry needs. The equipment set encompasses all sides of silicon processing including:

  •  Photomask design and printing.
  •  Photolithography
  •  Chemical vapour deposition
  •  Diffusion processes(doping and oxidation)
  •  Etch(wet chemical etch, RIE,  deep ICP etching)
  •  Metalisation
  •  Test
  • Chemical Mechanical Polishing

Follow the Foundry Link for more details of what is on offer.

A copy of the QAMEC Brochure can be found by following the link: publisher   pdf

For further information contact the QAMEC manager. 

 

Process Available

Wafer Size 
 

75mm 

100mm 

150mm 

200mm

LPCVD Poly silicon 

× 

× 

× 

 

PECVD Oxide/Nitride Deposition 

× 

× 

× 

×

CVD Tungsten/Silicide

 

× 

 

 

PVD Metal Deposition 

× 

× 

× 

 

Thermal Processing:  Wet and Dry Oxidation.

× 

× 

× 

 

3D nanoscale printing: Nanoscribe Photonic Professional GT

3D Polymer Printing from nm to micron scale

 

Chemical Mechanical Polishing 

 (contact for information)

× 

× 

× 

×

ALD Al2O3, HfO2

× 

× 

× 

 

Optical Lithography >4µm feature size

× 

× 

× 

 

Photoresist Coat and Develop

× 

× 

× 

×

EV Double Sided Aligner

× 

× 

× 

 

RIE IE of Si3N4,SiO2

× 

× 

×

 

ICP Deep Etch

× 

× 

× 

×

Oxide wet Etch 

× 

× 

× 

X

Poly Wet Etch 

× 

× 

× 

×

Metal Wet Etch 

× 

× 

× 

×

Wet Processing

× 

× 

× 

×

Surface Treatment 

× 

× 

× 

×

Evaporation

× 

 

 

 

Surface and Thin Film Measurement

  x x x x

Measurement and Test

x

 Test include CV, IV, Transistor characteristics etc

SEM

× 

× 

 

 

Mask Making. Design and manufacture

125 -150mm SQ reticle